Flexible interconnect cable with coplanar waveguide

ABSTRACT

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure. The cable can be coupled to destination components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.10/951,020 filed on Sept. 27, 2004 which is a continuation of U.S.patent application Ser. No. 10/107,667 filed on Mar. 26, 2002, now U.S.Pat. No. 6,797,891, which claims priority of U.S. ProvisionalApplication No. 60/365,696, filed on Mar. 18, 2002, all of which areincorporated by reference herein.

The subject matter of this application is related to the subject matterof U.S. patent application Ser. No. 10/107,661, titled “FLEXIBLE HIGHFREQUENCY INTERCONNECT CABLE INTEGRATED WITH A CIRCUIT SUBSTRATE,” nowU.S. Pat. No. 6,797,891, and U.S. patent application Ser. No.10/107,662, titled “HIGH FREQUENCY SIGNAL TRANSMISSION FROM THE SURFACEOF A CIRCUIT SUBSTRATE TO A FLEXIBLE INTERCONNECT CABLE,” now U.S. Pat.No. 6,867,668. The content of both of these applications is incorporatedby reference herein.

FIELD OF THE INVENTION

The present invention relates generally to interconnect devices forelectronic components. More particularly, the present invention relatesto a flexible interconnect cable design suitable for use in very highfrequency applications.

BACKGROUND OF THE INVENTION

Many telecommunication and data communication systems support very highspeed data and/or clock rates. For example, many practical digitalcommunication systems process data at speeds of up to 40 Gigabits/second(“Gbps”), and the fiber optics telecommunication industry (and othertechnology sectors) continue to develop communication systems capable ofhandling even faster data rates. Practical high speed data communicationsystems employ a number of interconnected elements such as electronicdevices, components, modules, circuit boards, subassemblies, and thelike. High speed clock/data inputs and outputs of such elements must beinterconnected at the subsystem and system levels.

The prior art contains a limited number of interconnect solutionssuitable for use at very high speeds (e.g., 40 Gbps and higher). Forexample, single-ended threaded microwave connectors and microwaveinterconnect cabling is often utilized between integrated circuitpackages, electronic components, and optical modules. Such connectors,however, require cumbersome cable layouts, require large specializedcomponent packages, and preclude the use of differential signaling(which provides a number of advantages such as common mode immunity). Inan effort to eliminate bulky connectors and cabling altogether, recentindustry proposals have centered around complex interconnections betweenthe integrated circuit substrate and the optics module substrate, wheresuch interconnections utilize various wire bonding and specializedsignal launch techniques (an approach requiring intimate deviceco-location and precise package alignment).

Very high speed integrated circuit chips are often manufactured in theform of a flip chip die having a number of high speed inputs andoutputs. A common interconnect technique employs a circuit substrate(such as a ball grid array (BGA) substrate) upon which the flip chip dieis mounted. The circuit substrate includes multiple conductive layersseparated by insulating layers and conductive vias that form aninterconnect structure for both high speed and low speed signals; thecircuit substrate itself is then mounted to a circuit board or card. Thesubstrate acts as an interposer, redistributes signals from the finepitch chip solder bumps to the BGA solder balls, and providescoefficient of thermal expansion matching. The design of the high speedsignal interconnects in the circuit substrate can be complex and timeconsuming, resulting in added manufacturing costs. In addition, suchcircuit substrates must be custom designed to accommodate the physicaland electrical characteristics of the flip chip die and/or the physicaland electrical characteristics of the subassembly circuit board/card.

BRIEF SUMMARY OF THE INVENTION

A flexible electrical interconnect cable according to the presentinvention facilitates high speed signal transmission between electricaldevices, components, modules, circuit boards, and the like. Theinterconnect cable provides a relatively low cost solution for highspeed applications that support data rates of 40 Gbps (and higher). Theinterconnect cable may also be integrated with a circuit substrate in amanner that eliminates the need to design high speed interconnectswithin the circuit substrate, e.g., the printed circuit board.

The above and other aspects of the present invention may be carried outin one form by an electrical interconnect cable comprising a flexibledielectric layer and a flexible conductive layer coupled to the flexibledielectric layer, where the flexible conductive layer includes a numberof conductive traces of a high-frequency electrical transmission linestructure.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of the present invention may be derived byreferring to the detailed description and claims when considered inconjunction with the following Figures, wherein like reference numbersrefer to similar elements throughout the Figures.

FIG. 1 is a side view of an integrated circuit package connected to anoptics module via a flexible interconnect cable;

FIG. 2 is a cutaway top view of the arrangement shown in FIG. 1;

FIG. 3 is a cutaway perspective view of a portion of the arrangementshown in FIG. 1;

FIG. 4 is a schematic end view of the flexible interconnect cable asviewed from line A-A shown in FIG. 2;

FIG. 5 is a sectional side view of a portion of the flexibleinterconnect cable as viewed from line B-B shown in FIG. 2;

FIG. 6A is a plan view of an exposed portion of a flexible interconnectcable;

FIGS. 6B, 6C and 6D are perspective views of alternate transmission linestructures that may be utilized in a flexible interconnect cable;

FIG. 7 is a sectional view of an alternately configured flexibleinterconnect cable;

FIGS. 8A and 8B are sectional views of two alternately configuredflexible interconnect cables;

FIG. 9 is a plan view of the ends of a flexible interconnect cable;

FIG. 10 is a cutaway top view of an integrated circuit package having acarrier substrate compatible with a flexible interconnect cable;

FIG. 11 is a side view of the integrated circuit package shown in FIG.10 with a flexible interconnect cable coupled thereto;

FIG. 12 is a side view of an integrated circuit package connected to aflexible interconnect cable using alternate connection techniques;

FIG. 13 is a cutaway top view of the arrangement shown in FIG. 12;

FIG. 14 is a side view of an assembly including an electronic device, acircuit substrate, and a flexible interconnect cable;

FIG. 15 is a plan view of a circuit substrate suitable for use in theassembly shown in FIG. 14;

FIG. 16 is a side view of an assembly including two electroniccomponents connected by a flexible interconnect cable;

FIG. 17 is a plan view of a circuit board including a number ofelectronic components connected by a flexible interconnect cable;

FIG. 18 is a side view of an assembly including an electronic devicemounted to a circuit substrate;

FIG. 19 is a plan view of the assembly shown in FIG. 18; and

FIG. 20 is a stack-up diagram representing material layers in an exampleflexible interconnect cable suitable for use in the assembly shown inFIG. 18 and FIG. 19.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The particular implementations shown and described herein areillustrative of the invention and its best mode and are not intended tootherwise limit the scope of the invention in any way. Indeed, for thesake of brevity, conventional RF and microwave transmission line designtechniques, flip chip and ball grid array design considerations,substrate interconnect and via design techniques, and manufacturingtechniques such as laminating, metal deposition, etching, and the likemay not be described in detail herein. In addition, various electronicdevices, system components, or modules may be referred to herein asexample components to which a flexible interconnect cable may beconnected. In practice, the specific type of device, circuit, chip,package, module, circuit board, or component can vary from applicationto application.

The present invention provides a flexible electrical interconnect cablehaving a transmission line structure that is capable of propagating highspeed electrical signals at speeds up to (and in some cases, exceeding)40 Gbps. Preferred practical embodiments of the flexible interconnectcable can be suitably designed to carry very high frequency electricalsignals transmitted in an electro/optical data communications system.For example, such practical embodiments can be utilized for clock/datasignal propagation between serializer/deserializer (“SERDES”) integratedcircuits and optics modules, which in turn are interfaced to opticalfiber media. Such practical embodiments can be employed in synchronousoptical network/synchronous digital hierarchy (SONET/SDH) (and other)applications that accommodate 10 Gbps (OC-192) and 40 Gbps (OC-768) datarates. Of course, the present invention is not limited to any particularimplementation or application.

FIG. 1 and FIG. 2 depict a flexible interconnect cable 100 having afirst end 102 coupled to a first component 104 and having a second end106 coupled to a second component 108. For purposes of this example,first component 104 is an integrated circuit package comprising anelectronic device (e.g., a flip chip die) 110, a component carriersubstrate (e.g., a BGA substrate) 112 coupled to electronic device 110,and a cable receptacle 114 configured to receive flexible interconnectcable 100. In this example, second component 108 is an optics modulecomprising a component carrier substrate 116 and a cable receptacle 118.For ease of description, FIG. 1 depicts portions of first component 104and portions of second component 108 from a sectional perspective, andFIG. 2 depicts portions of first component 104 and portions of secondcomponent 108 from a cutaway top perspective. FIG. 3 is a cutawayperspective view of a portion of the arrangement shown in FIG. 1, FIG. 4is a schematic end view of flexible interconnect cable 100 as viewedfrom line A-A shown in FIG. 2, and FIG. 5 is a sectional side view of aportion of flexible interconnect cable 100 as viewed from line B-B shownin FIG. 2. The internal structure of flexible interconnect cable 100 asshown in FIG. 4 and FIG. 5 represents one preferred embodiment of thepresent invention. In practice, flexible interconnect cable 100 mayutilize any number of different internal structures depending upon theparticular application.

Referring to FIG. 4 and FIG. 5, a flexible interconnect cable accordingto the example embodiment generally includes a flexible conductive layer120, a flexible dielectric layer 122, and a flexible conductive groundlayer 124. As shown in FIG. 4, the cable may also include (at one orboth terminating ends) a stiffening element 126 that provides structuralrigidity to the end(s) of the flexible interconnect cable. In theexample embodiment, stiffening element 126 comprises one or moredielectric layers coupled together (FIG. 4 shows three dielectric layerslaminated together to form stiffening element 126). As shown in FIG. 5,the cable may also include an insulating jacket 128 over at least aportion of the length of the cable. In a practical embodiment,insulating jacket 128 may surround and protect the “body” of the cablewhile leaving the terminating ends and/or conductive pads of the cableexposed to facilitate coupling of the cable to the respectivecomponents.

Flexible dielectric layer 122 is preferably formed from a materialhaving a low, stable, homogeneous dielectric constant (M_(r)) and a lowloss tangent. For example, flexible dielectric layer 122 may be formedfrom polyester (M_(r)=2.7; loss tangent=0.0002), polyimide (M_(r)=3.5;loss tangent=0.007), or fluorocarbon (M_(r)=2.3; loss tangent=0.0003).The specific material chosen for dielectric layer 122 may vary fromapplication to application, and the flexible interconnect cable mayutilize any suitable material for dielectric layer 122, whethercurrently known or developed in the future. In a practical embodiment,the thickness of dielectric layer 122 can range between 0.002 inch to0.020 inch. The actual thickness of dielectric layer 122 may depend uponthe desired electrical characteristics, the desired transmission lineimpedance, and/or the desired physical characteristics (e.g.,flexibility and length) of the cable. Although not shown herein, aflexible interconnect cable may utilize a nonhomogeneous dielectriclayer and/or a multi-layer dielectric section in lieu of the singledielectric layer 122 shown in FIG. 4 and FIG. 5.

Flexible conductive layer 120 is coupled to flexible dielectric layer122 using any number of known techniques. In a practical embodiment,flexible conductive layer 120 is formed by depositing or laminating athin metal layer (having a thickness between 0.00035 inch to 0.0014inch) onto dielectric layer 122 and etching a desired pattern into themetal layer. Flexible conductive layer 120 can be formed from anysuitable conductive material such as copper, aluminum, or the like. Theresulting pattern of conductive layer 120 comprises a number ofconductive traces of a high-frequency electrical transmission linestructure. In addition, conductive layer 120 may comprise a number oflow-frequency (or DC) conductors. A number of different transmissionline configurations are described in more detail below.

Flexible conductive ground layer 124 is coupled to flexible dielectriclayer 122 such that flexible dielectric layer 122 resides betweenflexible conductive layer 120 and flexible conductive ground layer 124.Flexible conductive ground layer 124 can be formed by depositing orlaminating a thin metal layer (having a thickness between 0.00035 inchto 0.0014 inch) onto dielectric layer 122 and, if necessary, etching adesired pattern into the metal layer. In the example embodiment,conductive ground layer 124 covers most, if not all, of the surface offlexible dielectric layer 122.

In a practical embodiment, the length of the flexible interconnect cablemay be dependent upon a number of application-specific ortechnology-dependent parameters. For example, the insertion loss andgroup delay of the signal frequencies (or frequency) carried by thetransmission line structure as a consequence of the type of dielectricmaterials used in the cable, the transmission line impedance of thecable, and/or the configuration of the transmission line structure maydictate a maximum length of the cable. In this regard, a typicalflexible interconnect cable may have a length between two and twelveinches, depending upon the losses allowed in the system. The width ofthe flexible interconnect cable may also depend upon a number ofpractical considerations. For example, the configuration of thetransmission line structure, the number of signals carried by the cable,the gap between the conductive traces, the transmission line impedanceof the cable, and/or the configuration of the mating components maydictate the width of the cable body and the width of the cable ends.

The thickness of the flexible interconnect cable body may also varyaccording to a number of physical or electrical parameters, such as theconfiguration of the transmission line structure, the transmission lineimpedance of the cable, the number of conductive and dielectric layers,and/or the desired flexibility of the cable. In this regard, flexibleconductive layer 120, flexible dielectric layer 122, flexible conductiveground layer 124, and insulating jacket 128 can be suitably configuredto allow the flexible interconnect cable to achieve a minimum bendradius. In accordance with one practical embodiment, the minimum bendradius of the flexible interconnect cable is approximately three timesthe thickness of the cable. FIG. 1 depicts the bend radius (r) offlexible interconnect cable 100. The flexibility of the interconnectcable enables it to be twisted, bent, and routed to accommodate a numberof practical component layouts and to facilitate installation andremoval of the cable. The flexibility of the interconnect cable alsoallows it to be pre-formed during fabrication and, to a limited extent,user reformed to meet application-specific or assembly-specificconfiguration geometries. The flexibility of the interconnect cableeliminates the need for costly and bulky connectorized cables andadapters, and exotic substrate/board materials that may otherwise benecessary to route very high speed electrical transmission lines in somepractical installations.

The various layers of the flexible interconnect cable can be coupledtogether using any number of conventional methodologies. As describedabove, a conductive layer can be deposited directly onto a dielectriclayer. A plurality of layers can be laminated, glued, or otherwiseaffixed together to form a composite structure. After the internallayers of a flexible interconnect cable are laminated together,insulating jacket 128 can be formed around the laminated assembly using,e.g., conventional plastic extrusion techniques.

As mentioned above, a flexible interconnect cable according to thepresent invention includes one or more conductive layers and one or moredielectric layers that combine to form a wideband low-loss transmissionline capable of propagating signals at rates that can exceed 40 Gbps.The techniques of the present invention can be utilized with a number oftransmission line technologies, e.g., grounded coplanar waveguide(“GCPW”), coplanar waveguide (“CPW”), microstrip, stripline,edge/broadside coupled stripline, any known transmission linetechnology, and any transmission line topology that is developed in thefuture. For example, FIG. 4 depicts a flexible interconnect cable havinga GCPW transmission line structure. FIG. 6A is a plan view of an exposedportion of a flexible interconnect cable having a GCPW structure. TheGCPW structure is desirable due to its high relative velocity andminimal cross talk characteristics.

As best shown in FIG. 4 and FIG. 6A, conductive layer 120 includes anumber of conductive traces that form a CPW structure, while conductiveground layer 124 forms a ground plane that cooperates with theconductive traces to form a GCPW structure. In FIG. 4, ground traces areidentified by the letter “G”, the first of a differential signal tracepair is identified by the letter “P”, the differential complement signaltrace is identified by the letter “N”, and low speed serial traces areidentified by the letter “S”. In this example configuration, theflexible interconnect cable propagates each high speed data/clock signalas a differential signal using one “P” trace and one “N” trace. In asimple arrangement, each conductive trace follows a straight path alongthe length of the cable, as shown in FIG. 6A. In a practical embodiment,the conductive traces may follow curved or bent paths that may or maynot follow the longitudinal axis of the cable itself. In this regard,the length of individual signal traces may vary to satisfy any number ofelectrical criteria including signal length matching, physicalrelationship (e.g., one end “P”/“N” with “N”/“P” at the other end), orthe like. FIG. 6A depicts a number of conductive ground traces 130, adifferential signal trace 132, a differential complement signal trace134, and three low speed serial traces 136. In accordance with known RFand microwave design techniques and the dielectric electricalcharacteristics, the width of the conductive signal traces 132/134, thewidth of conductive ground traces 130, and the gaps between the signaland ground traces are selected to provide the desired transmission lineimpedance.

Although not a requirement of the invention, the flexible interconnectcable may include a number of ground vias 138 formed within dielectriclayer 122. Ground vias 138 establish a conductive path betweenconductive ground layer 124 and ground traces 130. Vias 138 enhance thehigh frequency performance of the flexible interconnect cable byconfining the electrical fields within dielectric layer 122 to the areabetween the signal trace and the respective ground trace. Otherwise, theelectrical fields may extend deeper within dielectric layer 122,resulting in increased propagation delay, frequency dispersion (groupdelay), insertion loss, and/or crosstalk.

The use of a CPW or a GCPW transmission line structure allows theflexible interconnect cable to be easily coupled to electrical devices,components, modules, circuit boards, and/or circuit substrates (due tothe coplanar nature of the signal and ground traces). For example,component carrier substrates such as BGA substrates are often designedwith CPW signal input and output traces, and flip chip devices can bedesigned for solder connection to a flat circuit substrate having CPWsignal traces formed thereon.

FIG. 7 is a sectional view of a flexible interconnect cable thatutilizes a microstrip transmission line structure in the body of thecable, FIG. 8A is a sectional view of a flexible interconnect cable thatutilizes a stripline transmission line structure in the body of thecable, and FIG. 8B is a sectional view of a flexible interconnect cablethat utilizes a broadside coupled stripline structure in the body of thecable. The flexible interconnect cable shown in FIG. 7 includes aflexible conductive layer that includes a number of conductive traces140, a flexible conductive ground layer 142, and a flexible dielectriclayer 144 between the conductive layer and conductive ground layer 142.Conductive traces 140, flexible dielectric layer 144, and flexibleconductive ground layer 142 combine to form the microstrip transmissionline structure. The flexible interconnect cable may also include asuitably configured stiffening element 146 (e.g., a number of dielectriclayers) located proximate the terminating end of the cable. As describedin more detail below, stiffening element 146 provides structuralrigidity to the cable end to facilitate coupling to the respectivedestination component.

The flexible interconnect cable shown in FIG. 8A includes a firstflexible conductive ground layer 148, a second flexible conductiveground layer 150, a flexible dielectric layer 152 located between thetwo ground layers 148/150, and a number of conductive traces 154embedded within flexible dielectric layer 152. Flexible ground layers148/150, flexible dielectric layer 152, and conductive traces 154combine to form the stripline transmission line structure. The highfrequency signals propagate through the stripline transmission line viaelectromagnetic fields between the respective conductive signal tracesand the conductive ground layers 148/150. Depending upon the proximityof the individual conductive traces, the transmission line structure maybe configured as an edge coupled stripline. An edge coupled striplinearrangement may be desirable to provide a means for differentialsignaling, reduce the amount of electromagnetic interference emissions,provide a means of common mode rejection, and/or simply reduce thephysical size of the cable. The flexible interconnect cable may alsoinclude a suitably configured stiffening element 156 (e.g., a number ofdielectric layers) located proximate the terminating end of the cable.As described in more detail below, stiffening element 156 providesstructural rigidity to the cable end to facilitate coupling to therespective component.

A flexible interconnect cable may alternatively employ a broadsidecoupled stripline structure. In contrast to the embodiment depicted inFIG. 8A, a broadside coupled stripline structure utilizes pairs ofconductors that are arranged in a stacked and offset configurationwithin the dielectric material. FIG. 8B depicts one example embodimentof a broadside coupled stripline structure implemented in a flexibleinterconnect cable. Such a configuration only slightly increases theoverall thickness of the cable because it adds a layer of conductivematerial and additional dielectric material to the construction.

The example transmission line structures shown in FIG. 7, FIG. 8A andFIG. 8B are intended to illustrate different non-CPW embodiments of thepresent invention. Although not shown in FIG. 7, FIG, 8A or FIG. 8B,these alternate embodiments may include any number of additionalconductive traces (as shown in FIG. 4 and FIG. 6A) capable ofaccommodating low frequency data/control signals between components. Thenumber of high speed conductive signal traces, the shape and size of theconductive signal traces, the thickness of the conductive and dielectriclayers, and other application-specific parameters may vary in apractical embodiment.

FIG. 6B and FIG. 6C depict four fundamental structures for highfrequency, low loss and high noise immunity transmission lines. Thetransmission line structures shown in FIGS. 6B and 6C may be utilized bya flexible interconnect cable according to the present invention. InFIG. 6B, a ground conductor 400, a “P” signal conductor 402, and an “N”signal conductor 404 form a differential coplanar waveguide (“D-CPW”).In FIG. 6C, ground conductor 400, signal conductor 402, signal conductor404 and a ground plane 406 form a differential grounded coplanarwaveguide (“D-GCPW”). These two transmission line structures haveseveral advantages over the conventional CPW and GCPW structures. InFIG. 6B, a ground conductor 408, a signal conductor 410, a groundconductor 412, a signal conductor 414, and a ground conductor 416 form aCPW structure; in FIG. 6C, ground conductor 408, signal conductor 410,ground conductor 412, signal conductor 414, ground conductor 416, andground plane 406 form a GCPW structure. Some of these advantages includehigher density of transmission lines per unit area due to the groundremoval between the “P” and the “N” signal conductors, increased noiseimmunity due to the common mode noise cancellation, and low EM emissionsdue to the differential nature. In addition, coplanar structures haveadditional advantages over non-coplanar or GCPW and D-GCPW shown in FIG.6C—e.g., better control of the higher order propagating modes that mayinterfere with the signal, vias are not required, easy integration incircuits and systems, and lenient attachment to the substrates.

In the D-CPW and D-GCPW, the width of the conductive signal traces, thespacing between them, the distance to ground, the width of conductiveground traces, and the thickness of the conductive layer determine theeven and odd impedances of the differential transmission line. Thesecharacteristics facilitate the achievement of any impedance within thefabrication limits by adjusting widths and spacing between lines andgrounds only. FIG. 6D depicts this property where the impedances oftransmission line sections 420 and 424 match the impedances oftransmission line sections 422 and 426, despite the different relativeconfigurations. This ability not only allows the easy interface betweenICs, substrates, and modules with different pitches, pad spacing or padsize, but also minimizes the discontinuities otherwise associated withthe dimensions of the transmission line.

If non-CPW transmission line structures are utilized by the flexibleinterconnect cable, then the terminating ends of the cable may includesuitable CPW transition structures. Such transition structures (notshown) are utilized to convert the microstrip or stripline transmissionline into a CPW transmission line that matches the CPW structure of thecomponent to which the cable will be connected. Thus, for example, thecable shown in FIG. 7 may include a suitable transition circuit, formedon the conductive layer, that changes the propagation mode frommicrostrip to GCPW. The cable shown in FIGS. 8A and 8B may also beoutfitted with CPW end structures by first transitioning inner layersignal conductors to outer layer CPW conductors using a combination ofvias and properly varied/controlled conductor line widths. Eachinner-to-outer conductor transition would be designed to maintain aconstant impedance throughout the structure such that, end to end, thecable electrical characteristics would closely approximate atransmission line of a single construction.

The flexible interconnect cable may include an AC coupled transmissionline structure (in lieu of or in addition to a DC coupled transmissionline). AC capacitive coupling can be realized using the following (andother) techniques. First, conductive traces formed within the flexibleinterconnect cable can be DC isolated and AC coupled through one or moredielectric layers separating the conductive traces. In this regard, anAC coupled transmission line can be formed with two overlappingconductive traces having a dielectric layer therebetween. The resultingtransmission line structure has no DC connectivity, yet functions as ahigh frequency transmission line above certain frequencies. As a secondexample, a general flexible interconnect cable can be designed toaccommodate AC (and/or DC) coupling via resistor, capacitor, and/orother electronic components directly installed onto the cable. Forexample, the flexible interconnect cable may utilize a conductive tracehaving one or more gaps formed therein, and suitable conductive pads towhich such electronic components can be connected to bridge the gaps.

The flexible interconnect cable may utilize magnetic AC coupling byoverlapping transformer distributed element structures along the lengthof the cable. In this regard, the transformer elements may be realizedby loop-shaped conductive traces or “windings” formed on differentlayers in the cable with very little dielectric material between theconductive traces. The conductive loops form magnetically coupledtransformers that facilitate signal propagation in the absence of actualDC connectivity. The transformer windings would represent primary andsecondary structures with input and output impedances that are eitherthe same or designed to provide an impedance translation such as high tolow or visa versa. Transformer structures could be used to convertsingle-ended signals into differential “P” and “N” compatible signaltypes or the reverse. Essentially all (if not a wide variety of)conventional transformer design topologies could be implemented onto aflex cable.

The configuration of the ends of the flexible interconnect cable mayvary depending upon the intended installation application, and the twocable ends need not be identically configured. The ends of the cable canbe designed to facilitate electrical coupling, connection, and/orcontact with a compatible component, such as an electronic device, acomponent carrier substrate, a circuit board, a waveguide, an electronicconnector, an electronic package, or the like. In this regard, an end ofthe flexible interconnect cable may be suitably configured toaccommodate, without limitation, one or more of the following connectiontechniques: a compression (or press-fit) connection, a wire or ribbonbonding connection, a welded connection including those formed usingultrasonic methods, a solder ball connection, or a bonding connectionincluding those formed using soldering methods. Furthermore, theflexible interconnect cable may be configured to establish suchconnections with components or devices along the body of the cable. Forexample, portions of the conductive traces (and/or conductive padscoupled to the conductive traces) may be exposed along the body of theflexible insulating jacket, thus facilitating coupling of electronicdevices to the cable or connection of the cable to other componentslocated between the two cable ends.

Flexible interconnect cable 100 shown in FIGS. 1-3 is configured to forma compression connection with first component 104 and with secondcomponent 108. More specifically, the example arrangement shown in FIGS.1-3 includes a compression connection between first end 102 of flexibleinterconnect cable and component carrier substrate 112, and acompression connection between second end 106 of flexible interconnectcable and component carrier substrate 116. In accordance with onepractical embodiment, each of the conductive traces formed by flexibleconductive layer 120 (see FIG. 4) terminates at an exposed conductivepad located proximate a terminating end of the cable. In this regard,FIG. 9 is a plan view of two ends of a flexible interconnect cable 158.A first end 160 of cable 158 includes a number of exposed conductiveground pads 162 corresponding to conductive ground traces formed withincable 158, a number of exposed conductive signal pads 164 correspondingto conductive signal traces formed within cable 158, and a number ofexposed conductive pads 166 corresponding to low-speed conductors formedwithin cable 158.

First end 160 of cable 158 represents a configuration suitable for usein the arrangement shown in FIGS. 1-3. An insulating jacket 168terminates before the end of the cable such that the conductive pads areexposed. The conductive pads are exposed on one side, while the oppositeside remains coupled to the adjacent dielectric layer. As shown in FIG.4, stiffening element 126 is located above the conductive pads.Stiffening element 126 provides mechanical support that tolerates thecompressive force necessary to hold cable 158 against the respectivecomponent. In this example configuration, the “connector” portion ofcable 158 is formed from the same laminate materials as the cableitself, and the “connector” end is an extension of the main cable body.

The second end 169 of cable 158 represents an alternate configurationwhere a portion of the conductive traces (or conductive pads connectedto the traces) are fully exposed, thus forming a number of tabsextending from the tip of cable 158. The different cable connectionschemes described herein can apply to either configuration shown in FIG.9.

Referring to FIG. 3, cable receptacle 114 may be a compression connectorconfigured to hold flexible interconnect cable 100 against componentcarrier substrate 112 to form a compression connection between theexposed conductive pads of cable 100 and a number of conductivesubstrate pads (not shown) formed on component carrier substrate 112. Inthis regard, the substrate pads on component carrier substrate 112correspond to the exposed conductive pads of cable 100 (in the preferredembodiment, component carrier substrate 112 includes CPW or, optionally,GCPW transmission line traces that end at the substrate pads). In apractical embodiment, the carrier substrate “connector” is formed inpart by the same substrate material to which electronic device 110 isattached. The installation of flexible interconnect cable 100 into cablereceptacle 114 establishes electrical contact between the exposedconductive pads of cable 100 and the conductive pads of substrate 112.In practical embodiments, the conductive pads of cable 100 are sized andshaped to match the corresponding conductive pads of component carriersubstrate 112. Thus, the transmission line of flexible interconnectcable 100 matches the transmission line of component carrier substrate112 when cable 100 is properly aligned with carrier substrate 112, thusforming a low-loss connection with very little impedance mismatching(return loss).

Cable receptacle 114 may utilize one or more springs, clips, tensionelements, screws, fasteners, hinges, sliding elements, or other devicesto create a uniform compressive force for holding flexible interconnectcable 100 against component carrier substrate 112. In one practicalembodiment, cable receptacle 114 receives the respective end of cable100 and, after engagement of a locking mechanism, cable 100 becomescoupled to carrier substrate 112. Flexible interconnect cable 100, cablereceptacle 114, and/or the component to which cable 100 is attached mayinclude features that promote proper installation of cable 100. Forexample, as shown in FIG. 2 and FIG. 4, cable 100 may include one ormore keyways 170 that engage with corresponding features of theinterconnected components. Keyways 170 ensure that the ends of flexibleinterconnect cable 100 are connected to the appropriate components andthat the conductive traces of cable 100 are properly aligned with thecorresponding traces of the interconnected components. Flexibleinterconnect cable 100, cable receptacle 114, and/or other elements ofthe interconnected components may include structural features (e.g.,ridges, shoulders, posts, or walls) that serve as alignment guides forthe installation of cable 100.

In lieu of the compression connection technique, the conductive tracesof a flexible interconnect cable can be electrically bonded to thecorresponding conductive pads formed on the interconnected component.For example, FIG. 10 is a cutaway top view of an integrated circuitpackage 172 having a carrier substrate compatible with a flexibleinterconnect cable. FIG. 10 depicts package 172 with the lid removed;the edge of the lid is represented by the dashed line. FIG. 11 is a sideview of integrated circuit package 172 with a flexible interconnectcable 174 coupled thereto. Package 172 includes an electronic device 176(e.g., a flip chip die) mounted to a component carrier substrate 178(e.g., a BGA substrate). As shown in FIG. 10, substrate 178 can beextended beyond the edge of the device lid to expose signal connectionpoints, including high speed transmission lines and other conductivetraces as required by the specific application. These conductive tracespreferably terminate at conductive substrate pads 180 that match thecorresponding connection points on flexible interconnect cable 174.

As shown in FIG. 11, flexible interconnect cable 174 can be directlybonded, soldered, or otherwise conductively attached to componentcarrier substrate 178 to form an electrical connection between thecomponent carrier traces and the cable traces. The electrical bondingestablishes electrical signal paths from component carrier substrate 178to cable 174. In a practical implementation where cable 174 will not bephysically stressed or moved after installation, conventional solderingcan provide an adequate physical and electrical connection.

FIG. 12 is a side view of an integrated circuit package 180 connected toa flexible interconnect cable 182 using alternate connection techniques,and FIG. 13 is a cutaway top view of the arrangement shown in FIG. 12.Package 180 generally includes an electronic device 184 (e.g., a flipchip die) and a component carrier substrate 186 (e.g., a BGA substrate).As shown, electronic device 184 is mounted to both carrier substrate 186and to a first end 188 of cable 182. In a practical flip chipembodiment, some of the flip chip solder balls are coupled to conductivepads (not shown) formed on the upper surface of carrier substrate 186,while some of the flip chip solder balls are coupled to correspondingconductive pads (obscured from view in FIG. 13) on cable 182.Accordingly, the exposed conductive pads of cable 182 (which may be asthe pads shown in FIG. 9) are suitably configured to facilitateelectrical bonding to corresponding solder balls formed on electronicdevice 184.

In accordance with conventional packaging techniques, carrier substrate186 includes traces and vias for establishing electrical conductivitybetween the flip chip terminals and the solder balls on the lowersurface of carrier substrate 186. High speed signals to and fromelectronic device 184 are preferably carried by cable 182. Consequently,the layout and terminals of electronic device 184, the configuration ofpackage 180, and cable 182 can be cooperatively designed to facilitate acompliant assembly.

Integrated circuit package 180 and/or flexible interconnect cable 182may include any number of features designed to mechanically attach orstabilize cable 182 to package 180. Such features may provide stressrelief for the connection between cable 182 and electronic device 184.For example, as depicted in FIG. 12, package 180 may be designed suchthat first end 188 of cable is sandwiched and held between a package lid190 and component carrier substrate 186. In addition, cable 182 may havea number of holes formed therein (positioned such that they do notaffect the electrical characteristics of the transmission linestructure) for receiving mounting/alignment pins 191 located on package180. Cable 182 and/or package 180 may utilize any number of additionalor alternative coupling methodologies to form a mechanically soundjunction.

As mentioned above, the end configuration of the flexible interconnectcable may be dictated by the intended application or installation. Forexample, a second end 192 of cable 182 is provisioned with an opticsmodule connector 194 designed for compatibility with a particular opticsmodule (not shown). Thus, a practical subassembly including integratedcircuit package 180 and attached cable 182 can be manufactured and madeavailable for installation at the subsystem or system level.Alternatively, one or more ends of cable 182 (and other cables describedherein) can be terminated with any conventional, custom, or semi-customconnector configured to form an electronic and/or mechanical connectionwith the end component, module, or device. For example, a flexibleinterconnect cable may be terminated with an Anritsu V® connector, anSMA (subminiature version A) connector, a Gilbert GPPO™ connector, orthe like.

FIG. 14 is a side view of an assembly 196 including an electronicpackage 198, a circuit substrate 200, and a flexible interconnect cable202. Electronic package 198 represents a flip chip package including aflip chip die 199. Cable 202 is coupled to circuit substrate 200utilizing yet another alternate connection methodology. Briefly, one ormore conductive pads (connected to or integrated with respectiveconductive traces 204) of cable 202 are electrically bonded tocorresponding conductive pads (connected to or integrated withrespective conductive traces 206) formed on the surface of circuitsubstrate 200. In this example embodiment, the end of cable 202 may besimilar to end 169 of flexible interconnect cable 158 (see FIG. 9),i.e., conductive traces 204 may terminate at exposed conductive tabsthat facilitate conductive bonding, soldering, welding, or otherelectrical coupling to the respective conductive pads on circuitsubstrate 200. In this example, conductive traces 204 are formed on asingle conductive layer sandwiched between two dielectric or insulatinglayers.

FIG. 15 is a plan view of circuit substrate 200, which includes anexample layout of conductive traces 206, along with a number ofadditional conductive traces 208 that need not be coupled to flexibleinterconnect cable 202. In this example, the terminating ends ofconductive traces 206 form conductive pads 210. In the preferredpractical embodiment, the conductive pads/tabs of flexible interconnectcable 202 are formed from the same material as conductive traces 204,and the conductive pads/tabs are configured to match the size, shape,and layout of conductive pads 210 located on circuit substrate 200.

In the preferred embodiment, conductive traces 204 are ultrasonicallywelded to conductive pads 210 to establish electrical contact betweenthe flexible interconnect cable 202 and circuit substrate 200. As shownin FIG. 14, ultrasonic welds 212 can be formed on each of the conductivetraces 204 utilizing conventional ultrasonic welding techniques. In apractical embodiment, gold (or other conductive material) plating on theconductive pads 210 and/or conductive traces 204 forms the ultrasonicwelds during the ultrasonic welding process. Assembly 196 may employmechanical features 214 (e.g., screws, tabs, posts, compressionelements, plugs, or the like) to strengthen the physical connectionbetween flexible interconnect cable 202 and circuit substrate 200.

In the example embodiment, circuit substrate 200 comprises an organic,LTCC, HTCC, or alumina multi-layer BGA substrate and electronic package198 comprises a flip chip die. As shown in FIG. 14, circuit substrate200 may include a suitable interconnect arrangement that providesconductive paths from solder balls 216 associated with electronicpackage 198 to solder balls (or conductive pads) 218 associated withcircuit substrate 200. In a practical embodiment, the conductive pathsthrough circuit substrate 200 can be utilized for relatively low speedsignals and DC connections, while conductive traces 206 can be utilizedfor relatively high speed signals that require a high frequencytransmission line structure for propagation. In this regard, FIG. 14shows a flip chip solder ball 220 connected directly to at least oneconductive trace 206.

FIG. 16 is a side view of an assembly 222 including two electroniccomponents 224/226 connected by a flexible interconnect cable 228. FIG.16 depicts an arrangement whereby component 224 and component 226 arecoupled together by directly bonding conductive tabs or traces of cable228 to corresponding conductive pads or traces located on components224/226. As described above, component 224 may include a componentcarrier substrate 228 having conductive pads formed on the same surfaceto which an electronic device 230 is mounted. Likewise, component 226may comprise a component carrier substrate 232 having conductive padsformed on the same surface to which an electronic device 234 is mounted.In a typical subsystem or system environment, components 224/226 caneach be mounted to a suitable circuit board (or card) 236 using solderballs 238 or other conductive connections. The configuration of flexibleinterconnect cable 228 and/or carrier substrates 228/232 allows cable228 to be easily installed after components 224/226 are mounted tocircuit board 236.

FIG. 17 is a top plan view of an example circuit board 240 including anumber of electronic components connected by a flexible interconnectcable 242. In this example, cable 242 is coupled to a first component244, a second component 246, and a third component 248 using the “directsubstrate” attachment technique described above in connection with FIG.14. FIG. 17 illustrates how a single flexible interconnect cable 242 canbe employed to establish a plurality of transmission line structuresbetween different assembly components. In this regard, a firsttransmission line structure 250 couples first component 244 to secondcomponent 246, while a second transmission line structure 252 couplesfirst component 244 to third component 248. In this example, circuitboard 240, which may be formed in accordance with conventionaltechniques (e.g., circuit board 240 may be an FR-4 board), includes anumber of board-mounted low speed signal traces 254 between firstcomponent 244 and second component 246 and a number of board-mountedelectronic components 256 (e.g., resistors, capacitors, diodes,inductors, or the like) that may be interconnected or connected tocomponents 244/246/248 using conventional circuit board interconnecttechniques. Thus, low cost interconnect techniques can be utilized forlow speed and DC connections, while high speed (e.g., up to 50 Gbps)signals can be propagated by flexible interconnect cable 242.

Conventional high speed (10-40 Gbps) BGA interconnect solutions exhibitrelatively high insertion loss, high electromagnetic radiation, and lowimpedance control. Furthermore, due to the complex internal interconnectstructure of BGA substrates, extensive three-dimensional microwavesimulations are necessary to characterize the electrical performance ofthe substrates—such simulations are very costly and time consuming. Inaddition, the discrete number of practical BGA solder ball sizes andpitches makes it difficult to optimize the design of the electronicdevice and/or the BGA substrate to which the electronic device iscoupled. If, however, a flexible interconnect cable is utilized to carrythe high speed signals between the electronic circuit and the BGAsubstrate, then a relatively straightforward two-dimensional simulationmodel can be utilized to design the subassembly.

Although the benefits of the present invention are best realized whenthe flexible interconnect cable is utilized to carry very high speedsignals (e.g., 10-40 Gbps), the connection technique described above inconnection with FIG. 14 need not be limited or restricted to very highspeed applications. Indeed, low speed applications can also employflexible interconnect cables having flexible conductive traces that aredirectly coupled to a component carrier substrate.

A flexible interconnect cable according to the present invention canalso be fabricated to extend the stiffening element into a componentcarrier substrate to form an interconnect assembly for an electronicdevice. In this regard, FIG. 18 is a side view of an assembly 258including an electronic device 260 mounted to a circuit substrate 262and underfilled, and FIG. 19 is a plan view of assembly 258. Assembly258 also includes a flexible interconnect cable 264 that is integratedwith circuit substrate 262; cable 264 is preferably configured inaccordance with the flexible cable techniques described herein. In thepreferred practical embodiment, electronic device 260 is a flip chip dieand circuit substrate 262 is a rigid/flex BGA substrate. Solder ballsformed on electronic device 260 establish electrical contact withcorresponding conductive pads formed on the upper surface of circuitsubstrate 262. In turn, BGA solder balls formed on the lower surface ofcircuit substrate 262 establish electrical contact with correspondingconductive pads formed on a circuit board, a card, or other component.Thus, circuit substrate 262 can include a suitably configuredinterconnect structure (comprising, e.g., one or more conductive layers,one or more dielectric layers, and a number of interconnect vias) thatprovides conductive paths from electronic device 260 to the BGA balls.High speed signals (and possibly other signals) can be transmitted overcable 264, thus eliminating the need to design high speed interconnectsthat pass completely through or into circuit substrate 262. In thepreferred practical embodiment, all high speed signals propagate onlyalong surface conductors of the rigid/flex substrate. Although not shownin FIG. 18 or FIG. 19, the opposite end of cable 264 can be suitablyconfigured for coupling to another component such as an electronicdevice, a functional module, a circuit board, a waveguide, a componentcarrier substrate, or the like.

In the preferred practical embodiment shown in FIG. 19, one or morelayers of flexible interconnect cable 264 are also utilized as layer(s)of circuit substrate 262. For example, a conductive layer of cable 264,which may include a number of conductive signal traces 266 and/or anumber of conductive ground traces 268, can extend within or ontocircuit substrate 262, thus forming a conductive layer of circuitsubstrate 262. In a GCPW embodiment, cable 264 also includes aconductive ground layer and an intervening dielectric layer, each ofwhich extends within circuit substrate 262. In a practical embodiment,circuit substrate 262 comprises a number of circuit substrate conductivelayers interspersed between a number of circuit substrate dielectriclayers, where one (or more) circuit substrate conductive layer is thesame conductive layer in cable 264, and where one (or more) circuitsubstrate dielectric layer is the same dielectric layer in cable 264.

Continuing with the description of FIG. 19, circuit substrate 262includes a device-mounting surface 270 upon which one or more conductivesubstrate traces (obscured from view in FIG. 19) are formed. As a resultof the integrated construction of assembly 258, the conductive traces offlexible interconnect cable 264 form a number of the conductivesubstrate traces. The conductive traces terminate at exposed conductivepads 272 (depicted in dashed lines) configured to facilitate electricalbonding to a corresponding solder ball formed on electronic device 260.Device-mounting surface 270 may also include any number of conductivetraces 273 that accommodate the mounting of discrete components 274directly onto circuit substrate 262. These conductive traces 273 can beelectrically coupled to the conductive traces of cable 264, to solderballs, and/or to interconnect elements (such as blind vias) of circuitsubstrate 262.

The combined circuit substrate 262 and flexible interconnect cable 264can be manufactured in accordance with conventional deposition, etching,laminating, and bonding techniques. The layers of cable 264 form afoundation upon which circuit substrate 262 is formed. In a practicalCPW embodiment, a conductive layer of cable 264 can serve as the initiallayer of circuit substrate 262, and a dielectric layer of cable 264 canserve as device-mounting surface 270 of circuit substrate 262.Additional dielectric and/or conductive layers of circuit substrate 262can be formed thereafter. One preferred embodiment utilizes knownrigid/flex substrate technologies to form circuit substrate 262.Alternate embodiments may utilize other suitable circuit substrate orcircuit board technologies.

FIG. 20 is a stack-up diagram representing material layers in an exampleflexible interconnect cable 300 suitable for use in the assembly shownin FIG. 18 and FIG. 19. The stack-up diagram (which is not to scale)depicts a cross section of cable 300 that includes different layers thatmay be found in cable 300. In a practical embodiment, the crosssectional configuration may vary along the length and/or width of cable300. For example, FIG. 20 does not depict conductive vias or conductivetrace patterns that may be formed in any given conductive layer.

Flexible interconnect cable 300 includes a cable section 302 coupled toa rigid base section 304. Cable section 302 may include any of theflexible interconnect cable structures described above, and rigid basesection 304 can employ conventional technologies to provide a mountingbase for cable section 302. In the example embodiment, rigid basesection 304 is configured in accordance with known BGA specifications.In this regard, rigid base section 304 includes a number of BGA solderballs 306 that represent conductive connection points associated withconductive traces and/or conductive vias formed in cable section 302.

Cable section 302 may include an upper covercoat or insulation layer308, a first conductive layer 310, a first adhesive layer 312, aflexible dielectric layer 314, a second adhesive layer 316, a secondconductive layer 318, and a lower covercoat or insulation layer 320.Upper and lower covercoat layers 308/320 for an outer insulating coverfor cable section 302. In the example embodiment, covercoat layers308/320 are formed from a suitable polyimide material. As described indetail above, conductive layers 310/318 and dielectric layer 314 form asandwich construction such that conductive traces formed in theconductive layers 310/318 provide a high frequency transmission linestructure. In a practical embodiment, conductive layers 310/318 arecopper layers. Adhesive layers 312/316 utilize a suitable adhesivematerial that bonds conductive layers 310/318 to dielectric layer 314while preserving the desired electrical characteristics of thetransmission line structure.

Rigid base section 304 may include an acrylic adhesive layer 322, afirst conductive layer 324, a first rigid clad layer 326, a secondconductive layer 328, a second rigid clad layer 330, a third conductivelayer 332, a third rigid clad layer 334, a fourth conductive layer 336,and BGA balls 306. Adhesive layer 322, which may comprise an acrylicadhesive, physically couples cable section 302 to rigid base section304. Rigid base section 304 may include any number of conductive layers(four conductive layers are depicted in FIG. 20), e.g., copper layers,that form a suitable interconnect arrangement. As shown in FIG. 20,conductive layers 324/328/332/336 alternate with rigid clad layers326/330/334 to form a sandwich construction. Rigid clad layers326/330/334 insulate the respective conductive layers from each otherand provide structural support to rigid base section 304. Rigid cladlayers 326/330/334 represent FR-4 dielectric layers in one exampleembodiment. In this manner, flexible cable section 302 is terminated atrigid base section 304, which is configured for mounting to a circuitboard, another substrate, or the like.

Assembly 258 can leverage relatively low cost substrate technologieswhile providing high speed interconnect cabling. The integrated natureof flexible interconnect cable 264 eliminates the need for high speedconnector devices and high speed interconnect transitions fromelectronic device 260 through circuit substrate 262. A circuit substratewith an integrated flexible interconnect cable may also be designed toaccommodate any number of discrete components, flip chips, and devices(in contrast to the single-device version shown in FIG. 18 and FIG. 19).In addition, the integrated flexible interconnect cable can be routed toany number of destination components (as in the example shown in FIG.17). The assembly can also be manufactured with one or more flexibleinterconnect cable sections devoted to the testing of internal pointsthat would otherwise be inaccessible. After such testing, the respectivesections of the flexible interconnect cable can be sheared off torestrict customer access to the internal test points.

In summary, a flexible interconnect cable configured in accordance withthe present invention is capable of carrying very high speed data/clocksignals (e.g., 40 Gbps and higher). The cable is a multi-layeredconstruction that includes at least one flexible conductive layercoupled to at least one flexible dielectric layer. Conductive signaltraces are located on the at least one conductive layer; the conductivesignal traces and the at least one dielectric layer combine to form ahigh frequency (e.g., RF or microwave) electrical transmission linestructure. The flexible interconnect cable can be terminated using anumber of different methodologies. At least the following connectiontechnologies are contemplated: a compression connection between thecable and a component carrier substrate; electrical bonding of the cableto a component carrier substrate; electrical bonding of the cable to anelectronic device; “standard” connectors attached to the end of thecable; and integration of the cable with a component carrier substrate.

The flexible interconnect cable provides a relatively low cost means tointerconnect very high speed electrical components, such as thosecommonly used in electro-optical communication systems. The cableenables designers to utilize conventional circuit substrate technologies(e.g., printed circuit boards and rigid BGA substrates) for relativelylow speed signals, while routing the high speed signals over theflexible cable transmission line. In this manner, the three-dimensionaldesign problem for a high speed substrate interconnect can be simplifiedinto a more manageable two-dimensional model from behavioral simulationthrough first time design success. Furthermore, use of the flexibleinterconnect cable can reduce the number of high frequency transitionsfrom the electronic circuit to the destination component, thus improvingthe integrity of the propagated signal by adding planarity to the signalpath.

The present invention has been described above with reference to anumber of preferred embodiments. However, those skilled in the arthaving read this disclosure will recognize that changes andmodifications may be made to the preferred embodiments without departingfrom the scope of the present invention. These and other changes ormodifications are intended to be included within the scope of thepresent invention, as expressed in the following claims.

1-26. (canceled)
 27. An electrical interconnect cable comprising: a flexible dielectric layer; a flexible conductive layer mounted to a first side of the flexible dielectric layer; a number of conductive traces on the flexible conductive layer; a flexible ground layer mounted to a second side of the flexible dielectric layer; the conductive traces including signal and ground conductive traces; and first signal traces and first ground conductive traces constituting a grounded coplanar waveguide configuration.
 28. The electrical interconnect cable of claim 27, further comprising means for connecting the ground conductive traces to the flexible ground layer.
 29. The electrical interconnect cable of claim 27, further comprising second signal traces disposed between the second ground traces for conducting low speed serial data.
 30. The electrical interconnect cable of claim 27, further comprising a stiffening element on the flexible ground layer.
 31. The electrical interconnect cable of claim 27, further comprising a terminating end of the cable and a number of exposed conductive pads near the terminating end, each of the conductive traces terminating at a respective exposed conductive pad.
 32. The electrical interconnect cable of claim 31, wherein each of the exposed conductive pads is shaped to match a corresponding conductive pad formed on a component carrier substrate.
 33. The electrical interconnect cable of claim 31, further including means for aligning the terminating end with components to be interconnected with the cable.
 34. The electrical interconnect cable of claim 33, wherein the means include a keyway.
 35. The electrical interconnect cable of claim 27, wherein the connecting means include vias.
 36. An electronic assembly comprising: an electrical interconnect cable with at least one terminating end, including: a flexible dielectric layer; a flexible conductive layer mounted to a first side of the flexible dielectric layer; a plurality of conductive traces on the flexible conductive layer; a flexible ground layer mounted to a second side of the flexible dielectric layer; a plurality of conductive cable pads near the terminating end, each conductive cable pad terminating a respective conductive trace; the conductive traces including signal and ground conductive traces; first signal and ground conductive traces constituting a grounded coplanar waveguide configuration; a component carrier substrate with a plurality of conductive substrate pads, each conductive substrate pad corresponding to a respective one of the exposed conductive cable pads; and means for connecting the conductive cable pads to their corresponding conductive substrate pads.
 37. The electronic assembly of claim 36, the connecting means including solder balls.
 38. The electronic assembly of claim 36, the connecting means including a compression connector.
 39. The electronic assembly of claim 36, further comprising vias connecting the ground conductive traces to the flexible ground layer.
 40. The electronic assembly of claim 36, further comprising a stiffening element on the flexible ground layer.
 41. The electronic assembly of claim 36, further comprising second signal traces disposed between second ground traces for conducting low speed serial data.
 42. The electronic assembly of claim 41, further comprising a stiffening element on the flexible ground layer.
 43. The electronic assembly of claim 42, wherein the connecting means include solder balls.
 44. The electronic assembly of claim 42, wherein the connecting means include a compression connector.
 45. The electrical interconnect cable of claim 36, further including means for aligning the conductive cable and substrate pads.
 46. The electrical interconnect cable of claim 45, the aligning means including a keyway in the cable, near the terminating end. 